WELCOME TO EDMEM 2026 !

- About to EDMEM 2026 !

The International Conference on Electronic Devices, Mechanical Engineering, and Materials (EDMEM 2026) will be held grandly in Chengdu, the Western China Science and Technology Center. This conference focuses on the cross integration and collaborative innovation of electronic devices, mechanical engineering, and advanced materials, aiming to build a high-level and interdisciplinary international academic exchange platform, gathering experts, scholars, researchers, engineers, and high-tech enterprise technical representatives in the fields of microelectronics, materials science, mechanical design, manufacturing engineering, automation, and intelligent systems. The conference will conduct in-depth discussions on cutting-edge topics such as high-performance semiconductor devices and integrated circuit design, new electronic packaging technologies and thermal management materials, the application of piezoelectric/magneto electric functional materials in sensors and actuators, the manufacturing and integration of micro nano electromechanical systems (MEMS/NEMS), flexible electronics and wearable devices driven by intelligent materials, performance optimization of advanced structural materials in precision machinery, the application of additive manufacturing (3D printing) in electronic mechanical integration, reliability and failure analysis of electronic devices, the structural functional integration design of composite materials in lightweight equipment, and the collaborative development of materials, devices, and systems in intelligent manufacturing. Through various forms such as keynote speeches, thematic forums, paper presentations, and technology exhibitions, we aim to promote the deep integration of electronics, machinery, and materials in the fields of high-end equipment, intelligent systems, and emerging technologies. EDMEM 2026 emphasizes the core concept of "material driven devices, mechanism integration, and intelligent future creation", committed to breaking through key common technology bottlenecks and serving the national integrated circuit, high-end manufacturing, and new material development strategies. The high-quality papers accepted by the conference will be recommended for publication in international journals indexed by SCI, EI, or Scopus to enhance academic influence.